EZ change diamond grinding shoes floor pads for HTC grinders - elliptic segments

item No : DGP-HTC-05
Segment type: metal bond,elliptic shape
Segment size: H10mm
Segment No.: 1-2pcs
Diamond Grit: #6-#200(coarse, medium, smooth)
Bond: soft, medium, hard
Body: steel base
Material grinding: concrete/terrazzo/stone floor
Production process: high-frequency welded

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EZ change diamond grinding shoes for HTC floor grinders - elliptic segments

This type diamond grinding shoes floor grinding pads with 1 or 2pcs metal bond elliptic segments are usually used on EZ change plate of HTC grinder, suitable for general (concrete, terrazzo, stone) floor grinding use, while mostly they are used for paint, glue, epoxy removal and floor coating.

Metal bond diamond segment has high strength, excellent wear resistance, and a low friction coefficient, it also has high grinding efficiency and low grinding force generates less heat in the grinding process.

The elliptic segment is ideal for removing heavy coating, it is extremely aggressive leaving and deep to medium scratch pattern, taking the floor from coarsely structured surface to pre-polishing.

We provide you with different metal bonds to fit different hardness of concrete, and a wide range of diamond grits can be chosen.

For coarse grinding(#6-#40), medium grinding(#50-#120), fine grinding(#150-#200).

Diamond grit No.: #6, #16, #20, #25, #30, #40, #50, #60, #80, #100, #120, #150, #170,#200.

Segment bond: soft, medium, hard.

Code No.	Segment Size/No.	Grit No.	Connection
DGP-HTC-05-1	H10mm*1pc	#6 - #200	HTC EZ change plate
DGP-HTC-05-2	H10mm*2pcs	#6 - #200	HTC EZ change plate

The above specifications & photos are for reference, other specifications may be available as per demand.

EZ change diamond grinding shoes floor pads for HTC grinders - elliptic segments

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