EZ change diamond grinding shoes floor pads for HTC grinders - round column segments

EZ change diamond grinding shoes for HTC floor grinders - round column segments

This type diamond grinding shoes floor grinding pads with 1-3pcs metal bond round segments are usually used on EZ change plate of HTC grinder, suitable for general (concrete, terrazzo, stone) floor grinding use, while mostly they are used for paint, glue, epoxy removal and floor coating.

Metal bond diamond segment has high strength, excellent wear resistance, and a low friction coefficient, it also has high grinding efficiency and low grinding force generates less heat in the grinding process. The round segment is ideal for removing heavy coating, it is extremely aggressive leaving and deep to medium scratch pattern,  taking the floor from coarsely structured surface to pre-polishing.

Advantage: very efficient for the toughest situations such as the removal of very persistent coating, and the high diamond concentration provides for a faster grinding rate while the high quality of the diamonds provides longer grinding life.

Features: excellent wear resistance, lower cost, better surface finish etc.

We provide you with different metal bonds to fit different hardness of concrete, and a wide range of diamond grits can be chosen.

For coarse grinding(#6-#40), medium grinding(#50-#120), fine grinding(#150-#200).

Diamond grit No.: #6, #16, #20, #25, #30, #40, #50, #60, #80, #100, #120, #150, #170,#200.

Segment bond: soft, medium, hard.

The above specifications & photos are for reference, other specifications may be available as per demand.