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Diamond grinding shoes floor grinding pads for Lavina grinders - parallelogram segments

item No : DGP-LAV-03
Segment type: metal bond, parallelogram shape
Segment size: 37x18x13mm
Segment No.: 1-2pcs
Diamond Grit: #6-#200(coarse, medium, smooth)
Bond: soft, medium, hard
Body: steel base
Material grinding: concrete/terrazzo/stone floor
Production process: high-frequency welded

Diamond grinding shoes floor grinding pads for Lavina grinders - parallelogram segments


Diamond grinding shoes floor grinding pads with 1 or 2pcs metal bond parallelogram segments for Lavina grinders, suitable for general floor grinding use, it is often used for rough leveling and grinding of concrete terrazzo stone floor, such as underground parking lot, factory floor, etc., to remove the attachment on its surface.


Metal bond diamond segment has high strength, excellent wear resistance, and a low friction coefficient, it also has high grinding efficiency and low grinding force generates less heat in the grinding process.


Lavina diamond pads with quick lock plate provide convenient and economical way for concrete floor preparation and grinding. The diamond grinding pad is held into the right position by a combination dovetail-magnet system, which prevents the grinding pad from slipping during the grinding or preparation work. Quick change diamond grinding pad requires quick change plates for attachment. The plates can be reusable and make the system more economical than traditional welded-button plates.


We provide you with different metal bonds to fit different hardness of concrete, and a wide range of diamond grits can be chosen.


For coarse grinding(#6-#40), medium grinding(#50-#120), fine grinding(#150-#200).

Diamond grit No.: #6, #16, #20, #25, #30, #40, #50, #60, #80, #100, #120, #150, #170, #200.

Segment bond: soft, medium, hard.


Code No.

Segment Size/No.

Grit No.

Connection

DGP-LAV-03-1

37*18*13mm*1pc

#6 - #200

Lavina quick lock plate

DGP-LAV-03-2

37*18*13mm*2pcs


The above specifications & photos are for reference, special segment size or bond may be available as per demand.


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