Ultra-thin Diamond Wire Saw Electroplated

The wires are used in manual, in-line, multi-wire cutting machines, it can replace the cutting process of light abrasive, they are perfect for precise cutting various types of artificial crystal, ceramic, quartz glass, monocrystalline silicon, polycrystalline silicon, sapphire and special metal materials and so on. Also applies to laboratory or research institutes to conduct research.

Features:

1. Diameter: 0.17mm/0.20mm/0.27mm/0.30mm/0.35mm/0.45mm/0.5mm/0.6mm/1mm, diameter deviation ≤ 0.01mm;
2. Cutting wire material: imported high-quality and strength steel cutting wire;
3. Diamond grit: 5μm-60μm, we can design according to the customer's requirements;
4. Tensile strength: 3200-3400Mpa;
5. Wire length: we can made according to user's requirements.

Code No.	Diamond Size(um)	Min Circle Diameter(mm)	Min Breaking Load(N)	Application
DWSUTE55	5-10	100	10	Silicon Slicing
DWSUTE60	6-12	100	13.5	Silicon Slicing
DWSUTE65	6-12/7-14	100	15.2	Silicon Slicing
DWSUTE70	7-14	100	17.2	Silicon Slicing
DWSUTE80	6-12/8-12	100	20.5	Silicon Slicing
DWSUTE145	8-12/8-16	130	40	Magnetic Material Cutting
DWSUTE180	30-40	130	49	Magnetic Material Cutting
DWSUTE195	30-40	130	50	Magnetic Material Cutting
DWSUTE210	23-35/30-40	130	60	Magnetic Material Cutting
DWSUTE230	30-40	130	70	Sapphire Cutting
DWSUTE240	30-40	130	78	Sapphire Cutting
DWSUTE250	30-40	150	80	Sapphire Cutting
DWSUTE260	30-40/35-45	150	83	Sapphire Cutting
DWSUTE320	40-50	150	150	Silicon Bricking and Cropping
DWSUTE350	40-50	150	200	Silicon Bricking and Cropping
DWSUTE370	30-40/40-50	200	200	Silicon Bricking and Cropping
DWSUTE420	40-50	200	280	Silicon Bricking/Squaring
DWSUTE450	40-50	200	280	Silicon Bricking/Squaring

Relevant products:

Marble Quarry Cutting Stone Squaring Quarry+Squring Stone Quarry Cutting Concrete Cutting