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EZ change diamond grinding
shoes
for HTC floor grinders - round column segments
This type diamond
grinding shoes floor grinding pads with 1-3pcs metal bond round
segments are usually used on EZ change plate of HTC grinder, suitable for general (concrete, terrazzo, stone) floor
grinding use, while mostly they are used for paint, glue, epoxy
removal and floor coating.
Metal bond diamond segment has high strength, excellent wear
resistance, and a low friction coefficient, it also has high
grinding efficiency and low grinding force generates less heat in
the grinding process.
The round
segment is ideal for removing heavy coating, it is extremely aggressive
leaving and deep to medium scratch pattern,
taking the floor from coarsely structured surface to
pre-polishing.
Advantage: very efficient for the toughest situations such as the
removal of very persistent coating, and the high diamond
concentration provides for a faster grinding rate while the high
quality of the diamonds provides longer grinding life.
Features: excellent wear resistance, lower cost, better surface
finish etc.
We provide you with
different metal bonds to fit different hardness of concrete, and a
wide range of diamond grits can be chosen.
For coarse grinding(#6-#40), medium grinding(#50-#80), fine grinding(#100-#200).
Diamond grit No.:
#6, #16, #20, #25, #30,
#40,
#50, #60,
#80,
#100, #120,
#150,
#170,#200.
Segment bond: soft,
medium, hard.
|
Code No. |
Segment Size/No. |
Grit No. |
Connection |
|
DGP-HTC-03-1 |
Ø18x13mm*1 |
#6 - #200 |
HTC EZ
change plate |
|
DGP-HTC-03-2 |
Ø18x13mm*2 |
|
DGP-HTC-03-3 |
Ø18x13mm*3 |
The above specifications & photos are for reference,
other
specifications
may be available as per demand.
Relevant Products:
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